Remove CPU BGA IC Handle Repair Tool Thin Mainboard Disassemble

●Motherboard repair tools demolition artifact. Such as remove A9 A8 CPU.
●Ultra-thin , capricious good, it can ease between the and the board at the end, is not easy to lead off point. （1cm=0.39Inches）
Common problem instructions:
1.To clean the edge position when the demolition and temperature around 200 Viny
2.Hot air to open 150 degrees, 60 pairs of large air speed for 2 minutes to warm up the motherboard
3.Hot air put a small head, a temperature of 350 degrees to open the first blow of the position about 10 seconds and then shake inserted into the bottom of the
4.When the from side to side is not inserted into the well after the time described the tin melting point not melt easily can be inserted to the .

Note:
1.Please allow 1-3cm error due to manual measurement. Please make sure you do not mind before you bid.
2.The colors may have different as the difference display, please understand.











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